logo
Welcome to Shenzhen XingTe Technology Co., Ltd.
+86 189 2525 3532

Fully Automatic Mobile Phone Headphone Speaker Assembly Production Line with High Yield Rate ≥97% and AOI Inspection

Basic Properties
Place of Origin: CHINA
Brand Name: XINGTE
Certification: CE,IOS9001,KC,ISO45001,ISO24001
Model Number: 1511
Trading Properties
Minimum Order Quantity: 1
Price: negotiable
Supply Ability: 2.000 sets per year
Product Summary
Fully Automatic Mobile Phone/Headphone Speaker Assembly Production Line Application Suitable for speaker units: 0809, 1206, 1508, 1511, 1609, 1712, 2016, and inner-weld Bluetooth earphone drivers φ6, φ8, φ10, φ12, φ14, etc. Equipment Overview This production line is designed for mobile phone speaker ...
Product Description
Fully Automatic Mobile Phone/Headphone Speaker Assembly Production Line
Application
Suitable for speaker units: 0809, 1206, 1508, 1511, 1609, 1712, 2016, and inner-weld Bluetooth earphone drivers φ6, φ8, φ10, φ12, φ14, etc.
Equipment Overview
This production line is designed for mobile phone speaker units and inner-soldered Bluetooth earphone drivers. It adopts high-standard domestic and imported components with precision tooling to guarantee product accuracy and stability.
Modular design enables quick and convenient process adjustment. Servo motors and ball screws are applied for dispensing to improve dispensing precision. AOI inspection is configured for all glue stations and key processes to greatly reduce defective outflow.
Equipment Features
  • Equipped with high-speed high-precision linear motors and servo modules for excellent stability, high yield and high throughput
  • AOI inspection installed at dispensing and key stations saves labor and eliminates misjudgment caused by operator fatigue
  • Strong compatibility fits most mainstream products on the market
  • Improved product quality through automated inspection systems
Main Process Flow (1511 Unit Example)
  1. Bracket feeding
  2. Automatic winding & lead bending
  3. AOI lead inspection
  4. Spot welding
  5. Wire cutting & wire stripping
  6. Continuity test
  7. AOI solder joint inspection
  8. Protective glue dispensing on solder joints
  9. Fixing wire glue dispensing
  10. AOI glue path inspection
  11. UV curing
  12. Bracket side glue dispensing
  13. AOI glue path inspection
  14. Diaphragm feeding
  15. Center glue dispensing
  16. AOI glue path inspection
  17. Diaphragm flipping & lamination onto bracket
  18. Lamination + upper & lower UV curing
  19. Semi-finished product flipping
  20. Secondary curing of center glue
  21. Magnetic circuit feeding
  22. Pressure holding & height measurement
  23. Magnetic circuit glue dispensing
  24. AOI glue path inspection
  25. UV curing
  26. Finished product collection
Technical Parameters
Parameter Specification
Product Size 6-20 mm
Output ≥2000 Pcs/h
Yield Rate ≥97%
Utilization Rate ≥85%
Control System PLC + Touch Screen
Feeding Method Automatic feeding via vibration plate / material bin
Power Supply 220V±10% 50Hz
Total Power 45 KW
Working Air Pressure >0.6 MPa
Compressed Air Pressure ≈0.5-0.7 MPa
Overall Dimension (L)16800 * (W)1000 * (H)1900 mm
Machine Weight Approx. 7500 KG
Related Products

Send An Inquiry