Deeply rooted in the field of optoelectronic semiconductor automation, Xingte Technology empowers independent innovation

Shenzhen Xingte Technology Co., Ltd.,founded in 2011,is a national Key Specialized and Innovative "Little Giant" enterprise, focusing on R&D, production, sales and technical services of automated equipment for optoelectronic‑chip packaging, optical‑path assembly and precision testing in optical‑communication and semiconductor industries. Located in Yanluo Subdistrict, Bao’an District, Shenzhen, we run a modern‑scale manufacturing base with mature mass‑delivery capability. More than 30 % of our employees are R&D staff, and we hold hundreds of independent intellectual‑property rights with strong technical‑research strength.

Our products are widely applied in high‑speed optical modules, optoelectronic chips, LiDAR, semiconductor packaging‑and‑testing and other core segments. We deliver one‑stop precision‑automation equipment solutions and have accumulated high‑quality customer resources by virtue of reliable product performance and stable after‑sales support, devoting ourselves to the localization of advanced optoelectronic‑semiconductor automated manufacturing equipment.

As a representative domestic solution, our automatic optical‑module align‑coupling machine is purpose‑built for mass production of 400G / 800G / 1.6T high‑speed optical modules. The integrated platform supports both dual‑Lens and dual‑FA coupling processes. Equipped with a ±50 nm high‑precision nano‑motion system, it meets coupling requirements for single‑mode optical devices including COB, BOX and optical engines.

Integrated high‑precision vision hardware enables end‑face inspection during feeding to boost overall coupling efficiency. Coupling‑process logic can be freely edited, and customized software interfaces allow customers to flexibly adjust workflows for varied products. The machine achieves stable coupling yield above 97 % and equipment availability over 93 %, balancing cycle time and batch‑to‑batch consistency. It is compatible with lenses, FA, MUX, DMUX and many other packaging types. Thanks to short development‑and‑commissioning cycles, it can be quickly deployed onto production lines, providing highly‑stable, high‑compatibility domestic automatic coupling solutions for optical‑communication manufacturers.

Moving forward, Xingte Technology will keep investing in R&D of optoelectronic‑semiconductor intelligent equipment. We will continue to optimize hardware platforms and process algorithms, cooperate closely with upstream‑and‑downstream partners, and contribute to the high‑quality development of China’s optical‑communication and semiconductor industries.

Company Info

Address: No. 8 Risheng Road, Yanluo Subdistrict, Bao’an District, Shenzhen, China

Tel: +86‑13823799689

Website: www.szxingte.com

E‑mail: xtxz001@xingtekj.com